Goods imported for the manufacture of excisable goods – concessional rate of duty.
Notification No. 25/99-Customs
Dated: 28-2-1999
G.S.R. 161(E)
In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, being satisfied that it is necessary in the public interest so to do, hereby exempts the goods specified in column (3) of Table below, and falling under the Chapters of the First Schedule to the Customs Tariff Act, 1975 (51 of 1975) specified in the corresponding entry in column (2) of the said Table, when imported into India for use in the manufacture of the finished goods specified in the corresponding entry in column (4) of the said Table, from so much of that portion of the duty of customs leviable thereon which is specified in the said First Schedule, as is in excess of the amount calculated at the rate of, –
(a) 5% ad valorem in the case of the imported goods specified in List A;
(b) 15% ad valorem in the case of the imported goods specified in List B; and
(c) 25% ad valorem in the case of the imported goods specified in List C:
Provided that the importer follows the procedure set out in the Customs (Import of Goods at Concessional Rate of Duty for Manufacture of Excisable Goods) Rules, 1996.
Table
Sr.No. |
Chapter |
Description of imported goods |
Description of finished goods |
(1) |
(2) |
(3) |
(4) |
1. |
LIST A |
Alpha cellulose paper/cotton paper; Electrical grade kraft paper; Tung oil; Volan/Silane treated glass fabric/cloth |
Copper clad laminates phenolic or paper phenolic or glass ep-oxy types; composite type copper clad laminates; printed circuit boards. |
2. |
25,28,40, 56,70,84, 85 |
Potassium carbonate/Pottasium Nitrate(prilled); Barium carbonate; Pumice powder; Cerium oxide; Anode buttons; Necks and Neck tubings; Wool felt; Spodumene |
Glass shell/parts of television picture tube. |
3. |
25,28,40, 70, 84, 85 |
Strontium carbonate; garnet powder; stud pins; Titanium dioxide; sodium antimonate; rubber sleeve |
Class shells/parts for colour picture tubes. |
4. |
Omitted |
||
5. |
28 |
High purity gases : Argon; halocarbon-14; halocarbon-116; halocar-bon-23; helium; silicon tetra-chloride; sulphur hexafluoride; chlorine; silane; hydrochloric acid; phosphine & silane mixture; boron trichloride; dichlorosilane; diborane; hydrogen bromide; phosphine in nitrogen; nitrous oxide; boron trifluoride; arsine & arsine mixture; phosphine in hydrogen; hydrogen; nitrogen |
Integrated circuits, Semi- conductor devices. |
6. |
28,29 |
High purity chemicals: |
Integrated circuits, Semi-conductor devices. |
7. |
28,29,38, 76 |
Cadmium sulphide; cadmium telluride; silicon dioxide; cadmium chloride; zinc telluride; indium; germane; disilane; phosphine; hydrogen fluoride; aluminium sputtering target; zinc oxide sputtering target, adhesive coated aluminium foil; high purity hydrogen high purity nitrogen; high purity argon; copper doped graphite paste; high purity methane; diborane in high purity helium |
Solar cells/modules. |
8. |
28,29,32 38,39,68 74 |
., Copper plating salts, their i, brighteners, levellers, condi tioners, replenishers, stabi lizers; Black Oxide Coating (Microtech) solution/ salts, predip solution/salts, palladium catalyst solution/ salts |
Printed Circuit Boards. |
9. |
28,29,32 38,71 |
Resistive, Conductive, Di-electric, Overglaze or solder pastes, compositions or inks in packing not exceeding 20 kg. |
Hybrid Microcircuits; Potentiometers; Resistors (other than heating resistors); Ceramic and Mica Capacitors; Conductive Rubber Switches/Key Boards. |
10. |
28,29,32, |
Ceramic bodies (coated or uncoated); bandoliering tape with or without adhesives; solder plated copper wire of dia. upto 1 mm; solder plated brass wire of dia. upto 1 mm; high melting point solder alloy; paper backed polyurethane tape; epoxy marking ink with or without hardner/thinner |
Thermistors. |
11. |
28,29,34 |
Resist stripper |
Semi-conductor devices, printed circuit boards. |
12. |
28,29,34, |
Special materials: Surfactant, tetra ethyl-ortho-silicate (TEOS); trimethyl borate (TMB); trimethyl phosphite (TMPI); trichloroethane (TCA); dichloroethylene; sputtering targets; photo resist primer; edge bead remover |
Integrated circuits, Semi-conductor devices. |
13. |
28,29,37 |
Photo resist & associated thinners or/and developers; photospin glass |
Semi-conductor devices, printed circuit boards. |
14. |
28,29,38 |
Electrolyte |
Etched or Formed Aluminium Foil, Electrolytic Capacitors. |
15. |
28, 29,38 |
Dopants or doping sources in all forms, and with or without precious metal constituents |
Semi-conductor devices. |
16. |
28,29,38, |
Epoxy/Epoxide resins/ Epoxy moulding powder, compounds or encapsulants; Fillers, thinners, hardeners, accelerators and fire retardants |
Capacitors; Semi-conductor Devices; Light Emitting Diodes; Moulded Piezoelectric Crystals; Liquid Crystal Displays; Electronic Valves and Tubes; Switches; Copper clad laminates of glass epoxy/paper expoxy type; composite type copper clad laminates; Delay lines; Line and Wave Traps; Potentiometers; Silicon Crystals or Silicon wafers; Connectors; Resistors (other than heating resistors); Deflection parts; Loudspeakers; Magnetic Heads; Paper Cones/ Spiders/Dust Caps for Loudspeaker; Hybrid Microcircuits; Printed parts. |
17. |
28, 32 |
Ferric Oxide of purity of 99% and above; Manganous Manganic Oxide of purity of 99% and above; Manganese di-oxide of purity of 99% and above, Manganous Oxide; Nickel Oxide; Strontium Carbonate |
Ferrites. |
18. |
28,38,39, |
Aluminium paste; ethylene vinyl acetate sheets (EVA); primer for EVA; Crane glass; tedlar coated aluminium sheet; phosphorous oxychloride; halo carbon (CF4)/Freon gas; tinned copper interconnect; toughened glass with low iron content and transmittivity of min. 90% and above; multilayered sheets with tedlar base; fluro polymer resin; ultra high purity (UHP) silane in UHP nitrogen; UHP silane; diborane in UHP silane; MOCVD grade phosphine in UHP silane; silver sputtering target; high purity tin tetrachloride; nitrogen trifluoride of 99% purity and above |
Solar cells/modules. |
19. |
28,39, 68, |
Blue steel lapping carriers/lapping carriers; lapping vehicles; lapping abrasive powder; lapping compound |
Mounted piezoelectric crystals; Printed Circuit Boards; Semi-conductor devices; Potentiometers; Resistors (other than heating resistors); Connectors; Switches; Relays; Tape deck mechanism; Magnetic heads; Deflection parts; DC micromotor upto 13.5 V not exceeding 20 Watt rating; Silicon in all forms, LED lamps and displays.. |
20. |
28,29, 81, |
Tantalum powder; Tantalum wire; CM Seals; Cans; Silver powder suspension; Manganese Nitrate; Heat shrinkable polyester tubing |
Tantalum capacitors. |
21. |
28,48,69, 75,78,81, |
Lead based ceramic composition; Magnesium titanate based ceramic composition; Neodium based ceramic composition; Alumina setters/slabs; Lint free paper/paper towels/filter paper; Zirconia milling media/high alumina tumbling media; Steel shots – copper plated hollow; Nickel and sulphonic acid based plating chemicals; Razer blades/doctor blades |
Ceramic dielectric (multilayer) capacitors. |
22. |
28, 68 |
Tantalum Neodyme oxide; Neodyme oxide; Strontium carbonate |
Ceramic Capacitors. |
23. |
28,70,73, |
Crystal Holders; Bases; covers; Glass Bulbs; Glass Bases; Nickel Eyelets; Springs; Solder wire 25 SWG or thinner; Chromium Pellets |
Mounted Piezoelectric crystals. |
24. |
28, 81 |
Tungsten rhenium wire; Suspension of aluminium oxide in binder; Suspension of tungsten powder and aluminium oxide in binder; Triple carbonate suspension of calcium, barium, strontium in binder |
Electron guns and electron gun parts. |
25. |
29 |
Tetra Bromo Bisphenol-A; Tricresyl/Aryl Phosphate |
Copper clad laminates for Printed Circuit Boards. |
26. |
32 |
Electron Phosphor |
Electronic Valves and Tubes |
27. |
32 |
Desmearing agents |
Printed Circuit Boards. |
28 |
32,35,39 |
Silicone based resins, oils, varnishes, lacquers, elastomers, with or without additives |
Semi-conductor Devices; Liquid Crystal Displays; Electronic Valves and Tubes; Resistors (other than heating resistors); Connectors; Magnetic Tape; Relays; Potentiometers; Switches; Capacitor grade metallised plastic film; Piezoelectric crystal; Hybrid Micro circuits. |
29. |
32,37, 39 |
Solder Mask/Resist in ink or film form, with or without associated catalysts |
Printed Circuit Boards. |
30. |
32,38 |
Screen printing inks, dyes, emulsions, lacquers, films (including sensitisers, hardners, catalysts) |
Semi-conductor devices, printed circuit boards, potentiometers, capacitors, hybrid microcircuits, printed parts, coils and inductors, resistors (other than heating resistors). |
31. |
32, 38 |
Internal Dag |
Electronic Valves and Tubes. |
32. |
35, 39 |
Polyamide coatings or adhesives |
Semi-conductor devices; Heat sinks; deflectioii parts. |
33 |
37 |
Photo Polymer Film |
Printed Circuit Boards; Liquid Crystal Displays. |
34 |
37, 39 |
High resolution, high contrast photographic films and photo stencil films; DIAZO (C6H5N2) films |
Printed Circuit Boards; semi-conductor devices; hybrid microcircuits. |
35. |
37, 70 |
High Resolution Photo Plates; Photomask Substrates |
High Resolution Photo Masks; Semi-conductor devices; Liquid Crystal Displays; Silicon Single Crystals or Wafers. |
36. |
37, 70 |
High resolution photo mask |
Semi-conductor devices; Printed Circuit Boards; Liquid Crystal Displays. |
37. |
38 |
Silicon in the form of undiffused wafers, discs or chips |
Semi-conductor devices. |
38. |
38,39,76 |
Polyvinyl flouride (TEDLAR); Tedlar Aluminium Tedlar |
Solar cells/modules. |
39. |
38, 81 |
Lithium niobate wafers |
Hybrid microcircuits. |
40. |
38, 85 |
Silicon in the form of diffused wafers, discs or chips (with or without molybdenum disc) |
Hybrid microcircuits or semi-conductor devices. |
41. |
38, 85 |
Getters |
Electronic valves and tubes. |
42. |
39 |
Glass epoxy or/and polyamide prepregs |
Multilayer Printed Circuit Boards; copper clad laminates. |
43. |
39 |
Silicone rubber |
Keypad switches; parts of EHT transformers. |
44. |
39 |
Plastic Film Capacitors or Mixed Dielectric Capacitors, other than Power Capacitors. |
Plastic Film Capacitors; Mixed Dielectric Capacitors. |
45. |
39 |
Nylon 6.30% glass filled, flame retardant moulding powder/granules and with or without other additives |
Potentiometers; connectors. |
46. |
39 |
Plain and glass filled nylon/polyamide with or without other additives |
Relays; Potentiometers; tape deck mechanism; connectors. |
47. |
39 |
Polypropylene moulding powder / granules |
Deflection parts; Cassettes. |
48. |
39 |
Polybutylene terephthalate |
Connectors; deflection parts; switches; relays. |
49. |
39 |
Heat shrinkable PVC sleeving, tubing, film or ring |
Capacitors; relays; deflection parts. |
50. |
39 |
Polyurethane lapping pads |
Mounted piezoelectric crystals; Printed Circuit Boards/semi-conductors devices; potentiometers; resistors (other than heating resistors); connectors; switches; relays; tape deck mechanisms; magnetic heads; deflection parts; DC Micromotors upto 13.5 volts and not exceeding 20 watts rating silicon (in all forms). |
51. |
39 |
Plain polystyrene film |
Plain film capacitors; mixed dielectric capacitors. |
52. |
39 |
Plain plastic film (other than Polystyrene film) of thickness 12 microns or below “Explanation.- For the removal of doubt, “plan plastic film” includes Biaxially Oriented Polypropylene (BOPP) film; |
Electronic capacitor grade metallised dielectric plastic film. |
53. |
39 |
Release film for multilayer laminates |
Printed Circuit Boards. |
54. |
39, 40 |
Polyvinyl Alcohol, Polyisobutylene, Chlorosulphona ted Polyethylene (HYPALON) |
Ferrites. |
55. |
39, 43 |
Antistatic materials in the form of tubes, strips, mats, covers, bins, boxes, containers |
Semi-conductor devices. Hybrid microcircuits. |
56. |
39,48,59, 85 |
Insulating/taping material (including pocket carrier tape) in tape, roll or strip form with or without adhesive |
Capacitors; deflection parts; resistors (other than heating resistors); semi-conductor devices; inductors. |
57. |
39,48,85 |
Domes or Dust caps; Paper/Plastic cones |
Loudspeakers. |
58. |
39,48,85 |
Parts of Potentiometers |
Potentiometers. |
59. |
39, 59, 73 |
Screen mesh of stainless steel/polyester/metallised polyester/metallised nylon (in sizes of mesh 60 or above) |
Ceramic capacitors. |
60. |
39, 69, |
Ceramic/alumina substrates |
Potentiometers; printed parts. |
61. |
39, 73, 79,85 |
Parts of magnetic sound heads |
Magnetic sound heads. |
62. |
39,74 |
Copper clad laminates laminated to nylon, teflon, polyester; Aluminium clad entry foil and back up laminates |
Printed Circuit Boards. |
63. |
39,85 |
Polyethylene terephthalate film with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 50 to 180 microinch |
Floppy diskettes. |
63A. |
39,73 |
Moulded shell with liner, Steel hub ring, spring, shutter |
Floppy diskette (3.5″ size). |
64. |
39,85 |
Parts/articles of silicone, Elastomer or Silicone rubber |
Liquid Crystal Displays; Semi-conductor Devices; EHT Transformers; Potentiometers; Electrolytic Capacitors; Solid tantalum capacitors. |
65. |
39,85 |
Formers, bases, bobbins; Holders, brackets; Shielding cases,cans |
RF/IF coils or transformers or deflection parts. |
66. |
40,59 |
Bungs; Rubber pinch rollers with or without plastic bush |
Electrolytic capacitors; tape deck mechanisms. |
67 |
40, 84,85 |
Parts of Rotor Assembly; Commutator assembly or parts thereof; Brush assembly or parts thereof |
DC Micromotors upto 13.5 volts and not exceeding 20 watts rating. |
68. |
40, 85 |
Anode assembly consisting of EHT cable, silicone rubber cap and contact spring or parts thereof (EHT cable in cut pieces or running length) |
Deflection parts. |
69. |
48 |
Electrolytic Capacitor/Condenser Tissue paper |
Electrolytic Capacitors; Plastic Film Capacitors. |
70. |
48,76 |
Kraft paper/tissue paper or aluminium foil for voice coil |
Loud-speakers (cone type). |
71 |
59 |
Felt sheet (fully compressed) of 1.5 mm thickness and below |
Tape deck mechanism. |
72. |
69, 78,85 |
Headers; Caps with or without leads; Cans with or without leads; Pins; Stud seals; Lead beads; Ceramic beads; Ceramic-glass packages; Cap to Lead Assembles; Ceramic Pipes; Lead frames, single or in roll form; Housings; Brass ring |
Semi-conductor devices; Light Emitting Diodes; Resistors (other than heating resistors); Capacitors; Connectors; Hybrid Microcircuits; Printed parts. |
73. |
69, 85 |
Alumina rods and bars (with Alumina content above 90%) in coated or uncoated form; Ceramic plates/flats/cases/ bases/formers; Steatite rods and bars in coated or uncoated form |
Resistors (other than heating resistors); Semi-conductor Devices; Hybrid Microcircuits; Electron Guns and Electron Gun parts. |
74. |
69,85 |
Ceramic dielectric (coated or uncoated) |
Ceramic capacitors. |
75. |
70 |
Glass filament yam |
Silane treated glass cloth/fabric for use in the copper clad laminates. |
76. |
32,70,85 |
Glass frit or glass powder; Glass preforms or pellets; Glass tubes |
Liquid Crystal Displays; semi-conductor devices; Electronic valves and tubes (other than television picture tubes/cathode ray tubes); Glass to metal seals; Lead frames; Transistor headers; Reed relays or Reed switches; delay lines; resistors (other than heating resistors); mounted piezoelectric crystals; electron guns and electron gun parts; gas discharge tubes. |
77. |
70, 85 |
Fused Quartzware |
Semi-conductor devices; silicon in all forms. |
78. |
71 |
Synthetic quartz crystal blocks and blanks |
Mounted Piezoelectric crystals. |
79. |
71 |
Contact tape with pure Nickel base and Crown Gold alloy; Contact tape with solder Diamond Back in fine silver; Contact tape in silver or silver alloy with or without palladium with Gold overlay |
Relays; Switches. |
80. |
71 |
Gold in the form of wire, ribbon, preform of purity 99.99 % and above |
Semi-conductor devices; Light Editing Diodes. |
81. |
71, 72, 75,80 |
Nickel plated steel strip; tin silver antimony alloy |
Semi-conductor devices. |
82. |
71, 76, 85 |
Aluminium wire with silicon or magnesium impurity of upto 2%; gold wire with phosphorous or antimony doping |
Semi-conductor devices. |
83. |
72 |
CRNGO silicon steel strip /sheet/coil/hoop with or without tin plating |
DC Micromotor; Potentiometer; Resistors. |
84. |
72 |
Coated/uncoated electro-galvanised CRCA/ mild steel/ stainless steel in the form of sheet / strip /wire/coils |
DC Micromotor; tape deck mechanism. |
85. |
72,73 |
Iron of 99.7% purity and above |
Cast Alloy Permanent Magnets. |
86. |
72, 73, 75,81 |
Nickel Iron Cobalt Alloy in all forms |
Semi-conductor devices; electronic valves and tubes; transistor headers; glass to metal seals/lead frames; cast alloy permanent magnets; hybrid microcircuits; gas discharge tubes. |
87. |
72 or 73 |
Copper clad tin coated steel wire, dia 0.4 mm to 1.2 mm/ solder plated Copper cover steel wire (SPC). |
Lead tabs for electrolytic capacitors. |
88. |
73,85 |
Metal clad substrates in any form with or without tags |
Potentiometers; Hybrid microcircuits; Printed parts; semi-conductor devices; Light Emitting Diodes. |
89. |
74 |
Electrolytic Tough Pitch (ETP) Copper wire rods |
Lead wire for electronic parts. |
90 |
74 |
Solder plated/unplated brass-strips upto 100 mm width; silver plated brass strips upto 100 mm width |
Potentiometers/parts of potentiometers; connectors/parts of connectors; switches/parts of switches; relays/parts of relays |
91. |
74 |
Phosphor Bronze Sheets/ bars/ section/ flats/ strips/wire/rods/foils/ pipes, with or without plating |
Relays/parts of relays; Tape Deck Mechanism; connectors/parts of connectors; potentiometers/parts of potentiometers; Heat Sinks; cassettes; parts of cassettes; T.V.Tuner; telescopic antenna; gas discharge tubes/parts of gas discharge tubes. |
92. |
74 |
Beryllium Copper rods/ strips/sheets/wire/foils with or without plating; Rectangular Profile Brass material(CuZn39Pb2) |
” Connectors/parts of connectors; relays/parts of relays; switches/parts of switches; gas discharge tubes/parts of gas discharge tubes. |
93. |
74 |
Tin coated/solder plated copper wire |
Resistors. |
94. |
74 |
Continuous cast copper wire rod/copper scrap, electrolytic grade of purity 99.9% or above |
Copper foil for copper clad laminates. |
95. |
74,76, 85 |
Copper-cadmium braided wire/Self-soldering/self-bonding aluminium wire |
Loudspeakers; microphones. |
96. |
74,85 |
Oxygen-free high conductivity (OFHC) Copper base with weldable steel ring |
Semi-conductor devices. |
97. |
74,85 |
OFHC copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes |
Semi-conductor devices; electronic valves and tubes; transistor headers; glass to metal seals; capacitors. |
98. |
74,85 |
Rayon or Silk cover Litz wire of the following sizes -(a) 6, 8, 12 and 24 strands with each strand diameter 0.03 mm; (b) 6 or 9 strands with each strand diameter 0.04 mm |
RF/IF Coils or transformers. |
99. |
74,85 |
Parts made of OFHC copper |
Semi-conductor devices, electronic valves & tubes, transistor headers, glass to metal seals, capacitors. |
100. |
76 |
Etched or formed Aluminium Foils |
Electrolytic Capacitors. |
101. |
76 |
Plain Aluminium foil containing more than 99% Aluminium |
Etched or formed Aluminium foil; electrolytic capacitors or plastic film capacitors. |
102. |
76 |
Aluminium of purity 99% or above in the form of wire, strips, sheets, rods, bars, pipes, plates, sections, ribbons or shapes |
Cans or Leads for Electrolytic Capacitors; Semi-conductor Devices; Light Emitting diodes; Capacitors; Capacitor grade Metallised Plastic films; Potentiometers; Disc covers for electrolytic capacitors. |
103. |
81 |
Cobalt |
Cast Alloy Permanent Magne ts. |
104. |
81 |
High purity chromium powder (99.99% and above) |
Semi-conductor devices, Mounted piezo electric crystals, electronic valves and tubes, vacuum interrupter tubes. |
105. |
81,85 |
Molybdenum and molybdenum alloys, wrought, in all forms and articles and parts thereof |
Electronic Valves and Tubes; X-ray tubes; Semi-conductor Devices; Mounted Piezoelectric Crystals. |
106. |
84,85 |
Parts of Vacuum Interrupter Tubes |
Vacuum Interrupter Tubes. |
107. |
85 |
Self bonding/Self soldering insulated or enamelled copper wire |
Deflection parts; Loudspeakers; Relays; Magnetic Heads; RF/IF Coils ; Transformers(other than Power transformers) and DC Micromotors upto 13.5 volts and not exceeding 20 watts rating; electronic tuner. |
108. |
85 |
Parts of gas discharge tubes |
Gas discharge tubes. |
109. |
85 |
Light Emitting Diodes in the form of Chips, wafers or undiced discs |
Light Emitting. Diodes; Lamps and Displays. |
110. |
85 |
Parts of Cathode Ray Tubes (other, than Glass parts) |
Cathode Ray Tubes. |
111. |
85 |
Lead Tabs/Paddle Tabs |
Electrolytic Capacitors. |
112. |
85 |
Parts of Relays, Switches, Connectors |
Relays; Switches; Connectors. |
113. |
85 |
Parts of electron Guns |
Electron Guns, Television picture tubes or Cathode Ray Tubes. |
114. |
85 |
Casings of aluminium |
Electrolytic capacitors. |
115. |
85 |
Parts of CD-Deck Mechanism |
CD Deck Mechanism. |
116. |
85 |
Parts of Fly-back Transformer |
Flyback Transformers. |
117. |
85 |
Parts of Tuners |
TV Tuners. |
118. |
85 |
Parts of Data Cartridge |
Data Cartridge. |
119. |
85 |
Parts of transmitting tubes |
Transmitting tubes. |
120. |
85 |
Parts of deflection yoke (DY), excluding colour deflection yoke core |
Deflection parts. |
121. |
75,85, 90 |
Nickel and nickel alloys, wrought in all forms and articles thereof |
Semi-conductor Devices; Liquid Crystal Displays; Electronic valves and tubes; Pick-up cartridges; Stylii; X-Ray Tubes; Cast Alloy Permanent magnets; Transistor Headers; Glass to metal seals; Lead frames; Resistors (other than heating resistors); Magnetic Heads; Potentiometers; Electron guns and electron gun parts; Electro-magnetic shields; Encoders and synchros. |
122 |
39,74,75,76 |
Composite copper clad materials consisting of Paper + Epoxy + Glass cloth |
Printed Circuit Boards |
123 |
74 |
Glass Epoxy Copper clad laminates or Paper Phenolic Copper clad laminates |
Printed Circuit Boards |
124 |
74 |
Copper foils(plain or adhesive coated) |
Copper clad laminates (phenolic or glass epoxy types);composite type copper clad laminates; multi-layer Printed Circuit Boards |
125 |
28,29,38,72,74,84 |
Cupric Chloride Etchant; Ammonical Etchants; Solid Carbide Drills; Routers; Hot Air Levelling Flux; Electroless Copper Plating Solution; Sensitisers; Activators; Post Activators; Copper foil of refined copper; Colloidal / Semi colloidal Graphite (Shadow) |
Printed Circuit Boards |
126 |
28,29,39,68,71,81,82 |
Plastic Film for Wafer Dicing; Graphite Jigs / Block/ Rods / Plates; Dicing blades / wheels; Tungsten filament and or parts thereof; Tungsten Wire / Rod; Colour Paste and Diffusants; Silver conductive paste / Suspension; Palladium Wire; n- Butyl Acetate; Bonding Tools |
LED/LED Displays; Semiconductor Devices; Hybrid Microcircuits; Mounted Piezo Electric Crystals; Resistors; Potentiometers |
127 |
70,85 |
Parts of data graphic display tubes(colour), with a phosphor dot screen pitch smaller than 0.4mm |
Data graphic display tubes(colour), with a phosphor dot screen pitch smaller than 0.4mm |
128 |
70,75 |
Glass Tubes/ Insulators/ Spacers; Nickel Eyelets |
Mounted piezo electric crystals |
129 |
39 |
Diallylphthalate (DAP) Moulding Powder or Compound (Plain or Glass/Fiber filled with or without additives) |
Connectors; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Potentiometers; Relays of contact rating upto 7 amperes; Resistors |
130 |
39 |
Polyvinyl Chloride Film/Sheet |
Floppy Disks/Diskettes |
131 |
28,38,39 |
Gold plating make up and replenisher solutions and salts; Resins for gold recovery |
Semiconductor devices; LED/LED Displays; Connectors; PCBs |
132 |
74 |
Solder Plated Annealed Copper Wire (SCA) of diameter 0.4mm to 1mm |
Plastic film capacitors |
133 |
79 |
Zinc of purity 99% or above in Rod, Wire or Strip form; Zinc Wire / Zinc- Aluminum wire with dia up to 5mm ; Tin – zinc wire with dia upto 3mm |
Electronic Capacitor Grade Metallised Plastic Film / Capacitors |
134 |
80 |
Tin Foil/ Tin Alloy Foil |
Plastic Film Capacitors; Resistors (other than heating resistors) |
135 |
76 |
Aluminium wire (of purity 99.9% or above ) of dia upto 3mm |
Lead Wires/Lead Tabs for electrolytic capacitors; Electronic Capacitor grade Metallized Plastic film; Plastic film capacitors; semiconductor devices |
136 |
28 |
Barium Carbonate |
Ceramic Capacitors |
137 |
38,39,69 |
Hydroxy Propyl Methyl Cellulose Barium Titanate based or Lead Titanate based Ceramic composition / Powder |
Ceramic Capacitors, Ceramic Substrates /Rods/ Discs / Dielectric |
138 |
28 |
Magnesium Oxide (Purity not less than 98%); Zinc Oxide (Purity not less than 98%); Nickel Oxide (Purity not less than 98%); Aluminium Oxide (Purity not less than 99.9%); Vanadium Pentoxide (Purity not less than 99.9%); Lithium Carbonate (Purity not less than 99%); Manganese Carbonate (Purity not less than 98%); Bismuth Oxide (Purity not less than 99%); Cobalt Oxide (Purity not less than 99%); Copper Carbonate (Purity not less than 98%); Chromium Oxide (Purity not less than 98%); Indium Oxide (Purity not less than 99%); Dysprosium oxide (Purity not less than 99%); Gadolinium Oxide (Purity not less than 99%);Yttrium Oxide (Purity not less than 99.9%); Calcium Carbonate (Purity not less than 98%) ; Tin Oxide (Purity not less than 98%); Magnesium Carbonate (Purity not less than 99%); Iron Oxide (Purity not less than 99%); Barium Carbonate (Purity not less than 99%) |
Resistors; Ceramic Capacitors |
139 |
39,48,59 |
Resin -VAGH Co-Polymerised Vinyl Chloride Vinyl Acetate, |
|
140 |
39 |
Polyimide Film (Kapton) |
|
141 |
39 |
Modified Polyphenylene Oxide |
|
142 |
39 |
Phenolic Moulding Powder/ Resin |
|
143 |
72,74 |
Lead wires of Iron or non alloy steel plated or coated with other base metals |
Lead Tabs |
144 |
29,72,74,76, 85 |
Copper alloy resistance wire and strips; Steel or Aluminium in substrate or sheet form; Butyl DiGol |
|
145 |
81 |
Metal alloy targets |
Resistors; Resistor Grade Metallized Ceramic Cores |
146 |
85 |
Chip Transistors; Varicap Diodes |
Tuners; Modulators; Hybrid Micro Circuits |
147 |
74 |
Cladded Copper/ Copper Alloy Strip / Foil |
Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors |
148 |
28 |
Zinc Oxide (Purity minimum 99.5%); Strontium Oxide/ Strontium Carbonate; Zinc Stearate (Purity minimum 99%); Polyvinyl alcohol (PVA); Polyvinyl Butyral (Ash Content max 1%) |
Pre-Calcined Ferrite Powder (Spray Dried); Resistors |
149 |
28 |
Zirconium Oxide (Purity not less than 99%); Tin Oxide (Purity not less than 99%); Lanthanam Oxide (Purity not less than 99%); Zinc Oxide (Purity not less than 98%); Polystyrene (Purity not less than 98%); Magnesium Oxide (Purity not less than 98%); Calcium Carbonate (Purity not less than 98%); Tantalum Oxide (Purity not less than 99%); Barium Carbonate (Purity not less than 99%) |
Microwave Dielectrics; Ceramic Capacitors; Resistors ; Varistors; Thermistors |
150 |
39 |
Phenolic Moulding Powder / Resin |
Hybrid Micro circuits; Potentiometers; Ceramic Capacitors; Thermistors; Varistors ; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors |
151 |
39,69 |
Guide Ceramic; Guide LCP (Liquid Crystal Polymer) |
Print heads |
152 |
85 |
Parts of Loudspeaker |
Loudspeakers |
153 |
74,85 |
High Voltage Rectifier Diodes; Focus Potmeter; Electrolytic Tough Pitch Wire/Rods/Formed Pins/parts made thereof |
Deflection Components |
154 |
39 |
Polycarbonate (Plain or glass filled moulding powder) |
Resistors; Potentiometers; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC |
155 |
39 |
Poly Vinyl Acetate |
Resistors; Potentiometers; Hybrid Micro Circuits |
156 |
72 |
Nickel Iron (low carbon / gas free grade) in Sheet or strip form / EB Welded Triple Metal Strips./ Controlled Expansion Alloy Strips |
Resistors; Potentiometers ; |
157 |
39 |
SRBP (Synthetic Resin Bonded Paper) Substrates |
Potentiometers; Switches with contact rating les than 5 amperes at voltage not exceeding 250 Volts AC or DC |
158 |
25 |
Ball Clay |
Ceramic Cores / Substrates for resistors |
159 |
32 |
Borosilicate Glass Powder |
Parts of Electron Gun / Multiform Bead Glass Rods |
160 |
74 |
Unplated Brass Strips in Coil form 70 mm width; Phosphor Bronze Strips in Coil Form |
Connectors |
161 |
72,74 |
Bimetal sheets in coil forms / piece parts; Copper clad steel sheets in coil forms / piece parts |
Relays of contact rating upto 7 amperes |
162 |
28,29 |
Ammonium Dihydrogen Phosphate ; Ammonium pantaborate |
Electrolytic Capacitors |
163 |
38 |
Carbon/Flurographite Powder |
Potentiometers |
164 |
28,34 |
Boron Nitride Suspension ; Metallisation Inhabitation Fluid (Oil) |
Electronic Capacitor Grade metallised Plastic Film/ Plastic Film Capacitors |
165 |
29 |
Dowanol PX-16S (Non- CFC solvent) |
Flyback Transformers / Focus Resistors |
166 |
28,29,38,48 |
Monoalkylethers of ethylene glycol.; Flux 1544 ;Ammonium Hydroxide (CMOS Grade); Ammonia (NH3) (CMOS Grade); Lid perform; Chemcassette |
Semiconductor devices |
167 |
76 |
Etched Aluminium Foil |
Formed Aluminium Foil for electrolytic capacitors. |
168 |
28, 39 |
Dyes; Optical grade polycarbonate; Jewel box |
CD-R (unrecorded CD) |
LIST B
1. |
28 |
Litharge |
Glass shells/parts for colour picture tubes. |
2. |
28 |
Gamma Ferric Oxide |
Magnetic Inks or Magnetic Tape. |
3. |
38 |
Precalcined / Pre-sintered ferrite powder |
Ferrites |
4. |
58,69,84, 85 |
Molybdenum Silidde/ Molybdenum disilicide heating elements; conveying trays; saggers |
Ferrites |
5. |
Omitted vide Notification No.26/2002 dt.01.03.2002 |
||
6. |
Omitted vide Notification No.26/2002 dt.01.03.2002 |
||
7. |
Omitted vide Notification No.26/2002 dt.01.03.2002 |
LIST C
1. |
Omitted |
||
2. |
Omitted |
||
3. |
Omitted |
||
4. |
Omitted |
||
5. |
70 |
TV Glass bulbs/shells; CRT Glass Bulbs/shells; Magnetron Glass bulbs/shells |
Television picture tubes. Cathode Ray tubes or magnetrons. |
6. |
70 |
Glass parts for colour picture tubes (excluding neck or reneck tubes) |
Colour picture tubes. |
7. |
70 |
Parts of TV/CRT Glass bulbs/shells including panels, funnels. Glass tubes (excluding neck or reneck tubes) |
TV Glass bulbs/shells for TV picture tube or CRT Glass bulbs/shells for CRT. |
8 |
70 |
Neck or reneck tubes |
CRT Glass bulbs/shells for CRT. |
9. |
Omitted |
||
10. |
Omitted |
Notification No. 25/99-Cus., dated 28-2-1999 as amended by Notification No. 60/99-Cus., dated 11-5-1999 , No. 20/2000-Cus., dated 1-3-2000 No. 54/2000-cus., dated 4-5-2000. No. 20/2001-Cus, dated 01-03-2001, Notification No.26/2002 dt.01.03.2002 and Notification No 57/2002-cus dated 31-5-2002 and Notification No. 108/2002-Cus., dated 10-10-2002